Display unit and electronic apparatus including functional layer with light-emitting layer and hole injection layer

ABSTRACT

A display unit includes: a drive wire; a planarization layer covering the drive wire and having a connection hole; a relay electrode provided on the planarization layer and configured to be electrically connected to the drive wire through the connection hole; a filling member made of an insulating material and provided in the connection hole; a first partition wall made of a same material as that of the filling member and covering an end of the relay electrode; a first electrode covering the filling member and configured to be electrically connected to the relay electrode; a second electrode facing the first electrode; and a functional layer located between the first electrode and the second electrode, the functional layer including a light-emitting layer.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a Continuation of application Ser. No.16/133,014, filed Sep. 17, 2018, which is a Continuation of applicationSer. No. 14/603,816, filed Jan. 23, 2015, now U.S. Pat. No. 10,109,693,issued on Oct. 23, 2018, which claims the benefit of Japanese PriorityPatent Application JP 2014-021603 filed Feb. 6, 2014, the entirecontents which are incorporated herein by reference.

BACKGROUND

The present technology relates to a display unit including, for example,a functional layer such as an organic layer, a method of manufacturingthe same, and an electronic apparatus.

Recently, demand for higher definition in mobile displays has beengrowing. Since a display using an organic electroluminescence device isa self-luminous type display, the display has characteristics of a wideviewing angle and low power consumption, and application of the displayto mobile displays is expected.

As the organic electroluminescence device, for example, an organicelectroluminescence device with a configuration in which a firstelectrode, an organic layer including a light-emitting layer, and asecond electrode are laminated in order is known (for example, refer toJapanese Unexamined Patent Application Publication No. 2008-130363). Thefirst electrode is provided separately for each device, and a partitionwall configured of an insulating film is provided in a region betweenadjacent first electrodes. A driving device such as a transistor and aplanarization layer covering the driving device are arranged below thefirst electrode, and the driving device and the first electrode areconnected to each other through a connection hole provided in theplanarization layer. The connection hole is located in a positionoverlapping the partition wall in a plan view, i.e., in a non-lightemission region (for example, refer to Japanese Unexamined PatentApplication Publication No. 2001-148291). In other words, a lightemission region is arranged out of a region where the connection hole isformed, because a level difference caused by the connection hole affectslight emission of the organic electroluminescence device.

SUMMARY

When the arrangement of the light emission region is limited by theposition where the connection hole is formed in the above-describedmanner, a ratio of the light emission region to a pixel area is reduced,or the pixel area is increased to cause difficulty in achieving higherdefinition.

It is desirable to provide a display unit capable of arranging a lightemission region more freely, a method of manufacturing the same, and anelectronic apparatus.

According to an embodiment of the present technology, there is provideda display unit including: a drive wire; a planarization layer coveringthe drive wire and having a connection hole; a relay electrode providedon the planarization layer and configured to be electrically connectedto the drive wire through the connection hole; a filling member made ofan insulating material and provided in the connection hole; a firstpartition wall made of a same material as that of the filling member andcovering an end of the relay electrode; a first electrode covering thefilling member and configured to be electrically connected to the relayelectrode; a second electrode facing the first electrode; and afunctional layer located between the first electrode and the secondelectrode, the functional layer including a light-emitting layer.

According to an embodiment of the present technology, there is providedan electronic apparatus provided with the display unit, the display unitincluding: a drive wire; a planarization layer covering the drive wireand having a connection hole; a relay electrode provided on theplanarization layer and configured to be electrically connected to thedrive wire through the connection hole; a filling member made of aninsulating material and provided in the connection hole; a firstpartition wall made of a same material as that of the filling member andcovering an end of the relay electrode; a first electrode covering thefilling member and configured to be electrically connected to the relayelectrode; a second electrode facing the first electrode; and afunctional layer located between the first electrode and the secondelectrode, the functional layer including a light-emitting layer.

In the display unit and the electronic apparatus according to theembodiments of the present technology, the filling member is provided inthe connection hole of the planarization layer; therefore, a leveldifference caused by the connection hole is reduced. The firstelectrode, the functional layer, and the second electrode are laminatedin a position covering the filling member.

According to an embodiment of the present technology, there is provideda method of manufacturing a display unit including: forming a drivewire; forming a planarization layer covering the drive wire, and thenforming a connection hole in the planarization layer; forming a relayelectrode on the planarization layer and configuring the relay electrodeto be electrically connected to the drive wire through the connectionhole; forming a filling member made of an insulating material in theconnection hole and forming a first partition wall covering an end ofthe relay electrode with use of a same material as that of the fillingmember; forming a first electrode to cover the filling member andconfiguring the first electrode to be electrically connected to therelay electrode; and forming a functional layer including alight-emitting layer and a second electrode in this order on the firstelectrode.

In the method of manufacturing the display unit according to theembodiment of the present technology, the filling member made of theinsulating material is formed in the connection hole; therefore, a leveldifference caused by the connection hole is reduced. A light emissionregion is formed by providing the first electrode, the functional layer,and the second electrode in this order on the filling member.

In the display unit, the method of manufacturing the display unit, andthe electronic apparatus according to the embodiments of the presenttechnology, the level difference caused by the connection hole isreduced; therefore, the light emission region is allowed to be providedin a position overlapping the connection hole in a plan view. Therefore,the light emission region is allowed to be arranged more freely. It isto be noted that effects of the embodiments of the present technologyare not limited to effects described here, and may include any effectdescribed in this description.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the technology as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the technology, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments and,together with the specification, serve to explain the principles of thetechnology.

FIG. 1 is a sectional view illustrating a configuration of a displayunit according to a first embodiment of the present technology.

FIG. 2 is a diagram illustrating an entire configuration of the displayunit illustrated in FIG. 1 .

FIG. 3 is a diagram illustrating an example of a pixel drive circuitillustrated in FIG. 2 .

FIG. 4 is a diagram illustrating a light emission region of an organiclight-emitting device illustrated in FIG. 1 .

FIG. 5A is a sectional view illustrating a process of manufacturing thedisplay unit illustrated in FIG. 1 .

FIG. 5B is a sectional view illustrating a process following FIG. 5A.

FIG. 5C is a sectional view illustrating a process following FIG. 5B.

FIG. 6A is a sectional view illustrating a process following FIG. 5C.

FIG. 6B is a sectional view illustrating a process following FIG. 6A.

FIG. 7 is a diagram illustrating a configuration of a display unitaccording to Comparative Example 1.

FIG. 8 is a diagram illustrating a configuration of a display unitaccording to Comparative Example 2.

FIG. 9 is a sectional view illustrating a specific configuration in aneighborhood of a connection hole illustrated in FIG. 8 .

FIG. 10 is a diagram for describing a pixel region of the display unitillustrated in FIG. 1 .

FIG. 11 is a diagram for describing a light emission region of thedisplay unit illustrated in FIG. 1 .

FIG. 12 is a diagram illustrating a relationship between a size of thelight emission region and luminance degradation.

FIG. 13 is a sectional view illustrating a configuration of a displayunit according to Modification Example 1.

FIG. 14 is a sectional view illustrating a configuration of a displayunit according to Modification Example 2.

FIG. 15 is a sectional view illustrating a configuration of a displayunit according to Modification Example 3.

FIG. 16 is a sectional view illustrating a configuration of a displayunit according to Modification Example 4.

FIG. 17 is a sectional view illustrating a configuration of a displayunit according to Modification Example 5.

FIG. 18 is a sectional view illustrating a light emission state in thedisplay unit illustrated in FIG. 17 .

FIG. 19 is a sectional view for describing a case where color mixingoccurs.

FIG. 20 is a sectional view illustrating another example of the displayunit illustrated in FIG. 17 .

FIG. 21 is a diagram illustrating a configuration of a main part of adisplay unit according to a second embodiment of the present technology.

FIG. 22 is a sectional view illustrating a light emission state in thedisplay unit illustrated in FIG. 21 .

FIG. 23 is a sectional view illustrating a configuration of a displayunit according to Modification Example 6.

FIG. 24 is a sectional view illustrating another example of a fillingmember illustrated in FIG. 23 .

FIG. 25 is a sectional view illustrating a configuration of a displayunit according to Modification Example 7.

FIG. 26 is a diagram illustrating a configuration of a main part of adisplay unit according to a third embodiment of the present technology.

FIG. 27 is a diagram illustrating an example of a configuration of apartition wall illustrated in FIG. 26 .

FIG. 28 is a diagram illustrating another example of the configurationof the partition wall illustrated in FIG. 26 .

FIG. 29 is a diagram illustrating still another example of theconfiguration of the partition wall illustrated in FIG. 26 .

FIG. 30 is a sectional view illustrating a light emission state in thedisplay unit illustrated in FIG. 26 .

FIG. 31 is a diagram illustrating another example of the display unitillustrated in FIG. 26 .

FIG. 32 is a diagram illustrating another example of the configurationof the partition wall illustrated in FIG. 31 .

FIG. 33 is a diagram illustrating still another example of theconfiguration of the partition wall illustrated in FIG. 31 .

FIG. 34 is a diagram illustrating still another example of the displayunit illustrated in FIG. 26 .

FIG. 35 is a sectional view illustrating a configuration of a displayunit according to Modification Example 8.

FIG. 36 is a sectional view illustrating a light emission state in thedisplay unit illustrated in FIG. 35 .

FIG. 37 is a sectional view illustrating a configuration of a displayunit according to Modification Example 9.

FIG. 38 is a sectional view illustrating a configuration of a main partof a display unit according to a fourth embodiment of the presenttechnology.

FIG. 39 is a plan view illustrating a schematic configuration of amodule including any of the display units illustrated in FIG. 1 and thelike.

FIG. 40 is a perspective view illustrating an appearance of ApplicationExample 1.

FIG. 41 is a perspective view illustrating an appearance viewed from afront side of Application Example 2.

DETAILED DESCRIPTION

Some embodiments of the present technology will be described in detailbelow referring to the accompanying drawings. It is to be noted thatdescription will be given in the following order.

1. First Embodiment (Display unit: Top emission type)

2. Modification Example 1 (Example in which a relay electrode hasreflectivity)

3. Modification Example 2 (Example in which one relay electrode isconnected to a drive wire through a plurality of connection holes)

4. Modification Example 3 (Example in which a partial region of therelay electrode configures one electrode of a retention capacitordevice)

5. Modification Example 4 (Example in which an end of a first electrodeis covered with a partition wall)

6. Modification Example 5 (Example including a reflecting member on aside surface of the partition wall)

7. Second Embodiment (Example in which a first electrode extends to aside surface of a partition wall)

8. Modification Example 6 (Example in which a filling member and thepartition wall are integrally formed)

9. Modification Example 7 (Example in which an end of a first electrodeis covered with the partition wall)

10. Third Embodiment (Example including a partition wall covering a partof a surface of a relay electrode)

11. Modification Example 8 (Example including a reflecting member on aside surface of the partition wall)

12. Modification Example 9 (Example in which an end of a first electrodeis covered with the partition wall)

13. Fourth Embodiment (Example of bottom emission type)

First Embodiment

[Entire Configuration of Display Unit 1]

FIG. 1 illustrates a sectional configuration of a main part of anorganic EL display unit (a display unit 1) according to a firstembodiment of the present technology. The display unit 1 includes a TFTlayer 12 including transistors (a sampling transistor 44A and a drivingtransistor 44B in FIG. 3 that will be described later), a drive wire13A, a planarization layer 13, a relay electrode 14, and organiclight-emitting devices 20 in this order on a substrate 11. Each of theorganic light-emitting devices 20 may be configured of, for example, anyone of three sub-pixels (pixels PXLC in FIG. 2 that will be describedlater) of red (R), green (G), and blue (B), and a combination of thesethree sub-pixels functions as one pixel. FIG. 1 illustrates a redorganic light-emitting device 20R configured to emit red light and agreen organic light-emitting device 20G configured to emit green light,and a blue organic light-emitting device configured to emit blue lighthas a substantially same configuration as those of the red organiclight-emitting device 20R and the green organic light-emitting device20G. A partition wall 24 is provided between adjacent two of the organiclight-emitting devices 20. Such organic light-emitting devices 20 andthe partition wall 24 are covered with a sealing layer 25. A sealingsubstrate 31 faces the substrate 11 with the organic light-emittingdevices 20 and the sealing layer 25 in between. The display unit 1 is aso-called top emission type display unit in which light emitted from theorganic light-emitting devices 20 is extracted from the sealingsubstrate 31.

FIG. 2 illustrates an entire configuration of the display unit 1. Asillustrated in FIG. 2 , for example, a display region 40 in which aplurality of pixels PXLC (sub-pixels) each including the organiclight-emitting device 20 (refer to FIG. 1 ) are arranged in a matrixform is formed on the substrate 11, and a horizontal selector (HSEL) 41as a signal line drive circuit, a write scanner (WSCN) 42 as a scanningline drive circuit, and a power supply scanner (DSCN) as a power supplyline drive circuit are provided around the display region 40.

In the display region 40, a plurality of (an integer n) signal linesDTL1 to DTLn are arranged along a column direction, and a plurality of(an integer m) scanning lines WSL1 to WSLm and power supply lines DSL1to DSLm are arranged along a row direction. Moreover, each of the pixelsPXLC (any one of pixels corresponding to R, G, and B) is arranged at anintersection of each signal line DTL and each scanning line WSL. Each ofthe signal lines TDL is connected to the horizontal selector 41, and animage signal is supplied from the horizontal selector 41 to each of thesignal lines DTL. Each of the scanning lines WSL is connected to thewrite scanner 42, and a scanning signal (a selection pulse) is suppliedfrom the write scanner 42 to each of the scanning lines WSL. Each of thepower supply lines DTL is connected to the power supply scanner 43, anda power supply signal (a control pulse) is supplied from the powersupply scanner 43 to each of the power supply lines DSL.

FIG. 3 illustrates a specific circuit configuration example in the pixelPXLC. Each of the pixels PXLC includes a pixel circuit 50 including theorganic light-emitting device 20. The pixel circuit 50 is an active typedrive circuit including the sampling transistor 44A, the drivingtransistor 44B, a retention capacitor device 44C, an auxiliary capacitordevice 44D, and the organic light-emitting device 20.

In the sampling transistor 44A, a gate thereof is connected to thescanning line WSL corresponding thereto, and one of a source and a drainthereof is connected to the signal line DTL corresponding thereto, andthe other is connected to a gate of the driving transistor 44B. In thedriving transistor 44B, a drain thereof is connected to the power supplyline DSL corresponding thereto, and a source thereof is connected to ananode of the organic light-emitting device 20. Moreover, a cathode ofthe organic light-emitting device 20 is connected to a grounding wire44H. It is to be noted that the grounding wire 44H is wired as a commonwire to all of the pixels PXLC. The retention capacitor device 44C isarranged between the source and the gate of the driving transistor 44B.The auxiliary capacitor device 44D is arranged between the anode of theorganic light-emitting device 20 (the source of the driving transistor44B) and the grounding wire 44H.

The sampling transistor 44A is configured to sample a signal potentialof an image signal supplied from the signal line DTL by being broughtinto conduction according to a scanning signal (a selection pulse)supplied from the scanning line WSL to store the signal potential in theretention capacitor device 44C. The driving transistor 44B is configuredto receive supply of a current from the power supply line DSL that isset to a predetermined first potential (not illustrated) to supply adriving current to the organic light-emitting device 20 according to thesignal potential stored in the retention capacitor device 44C. Theorganic light-emitting device 20 is configured to emit light withluminance according to the signal potential of the image signal by thedrive current supplied from the driving transistor 44B. The retentioncapacitor device 44C has a role in compensating for a shortage ofcapacity of the organic light-emitting device 20 and increasing awriting gain of the image signal for the retention capacitor device 44.

[Main-Part Configuration of Display Unit 1]

Next, referring to FIG. 1 again, specific configurations of thesubstrate 11, the organic light-emitting device 20, the sealingsubstrate 31, and the like will be described below.

The substrate 11 may be formed of, for example, glass, a plasticmaterial, or the like capable of blocking permeation of water (watervapor) and oxygen. The substrate 11 is a supporting body with one mainsurface where the organic light-emitting devices 20 are formed in anarray. Examples of the material of the substrate 11 may include a glasssubstrate made of high strain point glass, soda glass (Na₂·CaO·SiO₂),borosilicate glass (Na₂O·B₂O₃·SiO₂), forsterite (2MgO·SiO₂), lead glass(Na₂O·PbO·SiO₂), or the like, a quartz substrate, and a siliconsubstrate. The substrate 11 may be configured by providing an insulatingfilm on a surface of such a glass substrate, such a quartz substrate, orsuch a silicon substrate. For the substrate 11, metal foil, or a film ora sheet made of a resin, or the like may be used. Examples of the resinmay include organic polymers such as poly(methyl methacrylate) (PMMA),polyvinyl alcohol (PVA), polyvinyl phenol (PVP), polyether sulfone(PES), polyimide, polycarbonate, polyethylene terephthalate (PET), andpolyethylene naphthalate (PEN). It is to be noted that, in the topemission type display unit, light is extracted from the sealingsubstrate 31; therefore, the substrate 11 may be formed of a permeablematerial or an impermeable material. For the sealing substrate 31, thesame material as the material of the substrate 11 may be used, or amaterial different from the material of the substrate 11 may be used.Moreover, the substrate 11 may be made of a flexible material.

The TFT layer 12 includes the above-described sampling transistor 44Aand the driving transistor 44B, and functions as an active device of theorganic light-emitting device 20. The transistors of the TFT layer 12may have an inverted stagger configuration (bottom gate type) or astagger configuration (top gate type). The source of the drivingtransistor 44B is electrically connected to the drive wire 13A.

The planarization layer 13 is configured to planarize a surface wherethe TFT layer 12 and the drive wire 13A are formed of the substrate 11,and may be configured of, for example, an organic insulating film madeof polyimide, an acrylic-based resin, a novolac-based resin, or thelike. Alternatively, the planarization layer 13 may be configured of aninorganic insulating film, for example, a single-layer film or alaminate film including one or more kinds of silicon oxide (SiO_(x)),silicon nitride (SiN_(x)), silicon oxynitride (SiON), and the like.

A connection hole H1 is provided in the planarization layer 13. Therelay electrode 14 on the planarization layer 13 and the drive wire 13Aare electrically connected to each other through the connection hole HEThe relay electrode 14 is provided between the drive wire 13A and theorganic light-emitting device 20, and is configured to electricallyconnect the drive wire 13A and the organic light-emitting device 20(more specifically, a first electrode 21 that will be described later)to each other. The relay electrode 14 is provided along a wall surface(a side surface and a bottom surface) of the connection hole H1 from atop of the planarization layer 13, and is in contact with the drive wire13A on the bottom surface of the connection hole HE The relay electrode14 is made of a conductive material with high reflectivity to lightemitted from the organic light-emitting device 20. For example, analuminum (Al)-neodymium (Nd) alloy with a thickness of about 200 nm maybe used for the relay electrode 14. Light extraction efficiency to afront surface is allowed to be improved by using the light-reflectiverelay electrode 14.

In this embodiment, a filling member 15 is so provided to the connectionhole H1 as to cover the relay electrode 14 in the connection hole HE Aswill be described in detail later, the filling member 15 is allowed toreduce a level difference caused by the connection hole H1 and toarrange a light emission region (a light emission region E in a part (B)in FIG. 4 that will be described later) in a position overlapping theconnection hole H1 in a plan view.

The filling member 15 is configured to fill the connection hole H1, andis provided to the connection hole H1 and its neighborhood. A position(a position in a Z direction) of a surface of the filling member 15 maybe preferably close to a position of a surface of the relay electrode 14on the planarization layer 13. For example, the surface of the fillingmember 15 may be so provided as to protrude from the surface of therelay electrode 14 on the planarization layer 13, and may be provided ina position closer by about 1 μm or less to the sealing substrate 31 thanthe surface of the relay electrode 14 on the planarization layer 13. Thesurface of the filling member 15 may be dented more than the surface ofthe relay electrode 14 on the planarization layer 13, and may beprovided in a position closer to the substrate 11 than the surface ofthe relay electrode 14 on the planarization layer 13. The filling member15 may be configured of, for example, an organic insulating film made ofpolyimide, an acrylic-based resin, a novolac-based resin, or the like.

The organic light-emitting device 20 is provided in a region including atop of the filling member 15 in a plan view. The organic light-emittingdevice 20 includes the first electrode 21, an organic layer 22 includinga light-emitting layer, and a second electrode 23 in this order from aposition closer to the planarization layer 13 (the substrate 11).

The first electrode 21 is so provided as to cover the filling member 15,and is in contact with the relay electrode 14 around the connection holeH1. FIG. 4 illustrates a specific configuration in proximity to theconnection hole H1, and a part (A) in FIG. 4 illustrates a sectionalconfiguration, and a part (B) in FIG. 4 illustrates a planarconfiguration. In the connection hole H1, the relay electrode 14 and thefirst electrode 21 face each other with the filling member 15 in between(refer to the part (A) in FIG. 4 ), and the relay electrode 14, thefilling member 15, and the first electrode 21 are provided in a positionoverlapping the connection hole H1 in a plan view (refer to the part (B)in FIG. 4 ). The first electrode 21 and the relay electrode 14 areprovided separately for each of the organic light-emitting devices 20.The relay electrode 14 is provided throughout a wider area than that ofthe first electrode 21 in a plan view, and is widened around the firstelectrode 21 (refer to the part (B) in FIG. 4 ).

The first electrode 21 may have, for example, both a function as ananode electrode and a function as a reflective layer, and may bedesirably made of a material with high reflectivity and a high holeinjection property. For such a first electrode 21, for example, aconductive material with a thickness in a laminate direction(hereinafter simply referred to as “thickness”) of about 100 nm to about300 nm both inclusive may be used. The thickness of the first electrode21 may be smaller than that of the relay electrode 14. Examples of thematerial of the first electrode 21 may include simple substances andalloys of metal elements such as chromium (Cr), gold (Au), platinum(Pt), nickel (Ni), copper (Cu), molybdenum (Mo), tungsten (W), titanium(Ti), tantalum (Ta), aluminum (Al), iron (Fe), and silver (Ag). Thefirst electrode 21 may be configured of a laminate of a plurality ofsuch metal films. For example, an Ag—Pd—Cu alloy prepared by containingabout 0.3 wt % to about 1 wt % both inclusive of Pd and about 0.3 wt %to about 1 wt % both inclusive of Cu in silver, or an Al-neodymium (Nd)alloy may be used for the first electrode 21. Although a material with alarge work function may be preferably used for the first electrode 21,even a metal with a small work function such as aluminum and an aluminumalloy may be used for the first electrode 21 by selecting an appropriateorganic layer 22 (in particular, a hole injection layer that will bedescribed later). The first electrode 21 may be made of a conductivematerial with high light transparency, and a reflective layer may beprovided between the substrate 11 and the first electrode 21.

The partition wall 24 is provided between adjacent two of the firstelectrodes 21. The partition wall 24 is configured to cover an end ofthe relay electrode 14 on the planarization layer 13, and is providedbetween the relay electrode 14 and the organic layer 22 in an outer edgeof the relay electrode 14. When such a partition wall 24 is provided,the adjacent organic light-emitting devices 20 are electrically isolatedfrom each other, and insulation between the relay electrode 14 and thesecond electrode 23 is secured. In a region where the partition wall 24is not provided, the surface of the first electrode 21 and the organiclayer 22 or the surface of the relay electrode 14 and the organic layer22 are in contact with each other. Each of a contact region between thefirst electrode 21 and the organic layer 22 and a contact region betweenthe relay electrode 14 and the organic layer 22 serves as a lightemission region (a light emission region E in the part (B) in FIG. 4 ).Thus, in the display unit 1, the shape of the light emission region E ofthe organic light-emitting device 20 is controlled by the partition wall24. Moreover, the partition wall 24 covering the end of the relayelectrode 14 has a role in preventing a short circuit between the relayelectrode 14 and the second electrode 23 caused by the thickness of therelay electrode 14. The partition wall 24 may preferably have a taperedshape to enhance light extraction efficiency of the organiclight-emitting device 20. The partition wall 24 is made of the samematerial as that of the filling member 15, and may be formed, forexample, in a same process as a process of forming the filling member15. A height (a distance in the Z direction) of the partition wall 24 issubstantially the same as that of the filling member 15, and may be, forexample, about 1 μm to about 5 μm both inclusive.

The organic layer 22 may be provided as a common layer for all of theorganic light-emitting devices 20, and includes a hole injection layer,a hole transport layer, the light-emitting layer, an electron transportlayer, and an electron injection layer (all not illustrated) in thisorder from a position closer to the first electrode 21. The organiclayer 22 may be configured of the hole transport layer, thelight-emitting layer, and the electron transport layer, and in thiscase, the light-emitting layer may also serve as the electron transportlayer. The organic layer 22 may be configured by laminating a pluralityof such laminate units (so-called tandem units) with a connection layerin between. For example, the organic layer 22 may include tandem unitsfor respective colors of red, green, blue, and white, and may beconfigured by laminating the tandem units. The thickness of the organiclayer 22 may be, for example, about 100 nm to about 300 nm bothinclusive.

The hole injection layer is a buffer layer to enhance hole injectionefficiency and to prevent leakage. The hole injection layer may have,for example, a thickness of about 1 nm to about 300 nm both inclusive,and may be made of, for example, a hexaazatriphenylene derivativerepresented by Chem. 1 or Chem. 2.

where R¹ to R⁶ each are independently a substituted group selected froma group configured of hydrogen, a halogen, a hydroxyl group, an aminogroup, an arylamine group, a substituted or unsubstituted carbonyl groupwith 20 or less carbon atoms, a substituted or unsubstituted carbonylester group with 20 or less carbon atoms, a substituted or unsubstitutedalkyl group with 20 or less carbon atoms, a substituted or unsubstitutedalkenyl group with 20 or less carbon atoms, a substituted orunsubstituted alkoxyl group with 20 or less carbon atoms, a substitutedor unsubstituted aryl group with 30 or less carbon atoms, a substitutedor unsubstituted heterocyclic group with 30 or less carbon atoms, anitrile group, a cyano group, a nitro group, and a silyl group, andadjacent groups R^(m), where m=1 to 6, may be joined together through acyclic structure, and X¹ to X⁶ each are independently a carbon atom or anitrogen atom.

The hole transport layer is configured to enhance hole transportefficiency to the light-emitting layer. For example, the hole transportlayer may have a thickness of about 40 nm, and may be made of4,4′,4″-tris(3-methylphenylphenylamino)triphenylamine (m-MTDATA) orα-naphthyl phenyl diamine (αNPD).

The light-emitting layer is a light-emitting layer for white lightemission, and may have, for example, a laminate body of a redlight-emitting layer, a green light-emitting layer, and a bluelight-emitting layer between the first electrode 21 and the secondelectrode 23 and between the relay electrode 14 and the second electrode23. The red light-emitting layer, the green light-emitting layer, andthe blue light-emitting layer emit red light, green light, and bluelight, respectively by the recombination of some of holes injected fromthe first electrode 21 through the hole injection layer and the holetransport layer and some of electrons injected from the second electrode23 through the electron injection layer and the electron transport layerin response to the application of an electric field.

The red light-emitting layer may include, for example, one or more kindsselected from a red light-emitting material, a hole transport material,an electron transport material, a both-charge transport material. Thered light-emitting material may be a fluorescent material or aphosphorescent material. The red light-emitting layer may have, forexample, a thickness of about 5 nm, and may be made of4,4′-bis(2,2-diphenylvinyl)biphenyl (DPVBi) mixed with about 30 wt % of2,6-bis[(4′-methoxydiphenylamino)styryl]-1,5-dicyanonaphthalene (BSN).

The green light-emitting layer may include, for example, one or morekinds selected from a green light-emitting material, a hole transportmaterial, an electron transport material, and a both-charge transportmaterial. The green light-emitting material may be a fluorescentmaterial or a phosphorescent material. For example, the greenlight-emitting layer may have a thickness of about 10 nm, and may bemade of DPVBi mixed with about 5 wt % of Coumarin6.

The blue light-emitting layer may include, for example, one or morekinds selected from a blue light-emitting material, a hole transportmaterial, an electron transport material, and a both-charge transportmaterial. The blue light-emitting material may be a fluorescent materialor a phosphorescent material. For example, the blue light-emitting layermay have a thickness of about 30 nm, and may be made of DPVBi mixed withabout 2.5 wt % of 4,4′-bis[2{-4-(N,N-diphenylamino)phenyl}vinyl]biphenyl(DPAVBi).

The electron transport layer is configured to enhance electron transportefficiency to the light-emitting layer. For example, the electrontransport layer may be made of tris(8-hydroxyquinoline) aluminum (Alq3)with a thickness of about 20 nm. The electron injection layer isconfigured to enhance electron injection efficiency to thelight-emitting layer. The electron injection layer may be made of, forexample, LiF, Li₂O, or the like.

The second electrode 23 is paired with the first electrode 21 and therelay electrode 14 with the organic layer 22 in between, and is providedas a common electrode for all of the organic light-emitting devices 20.The second electrode 23 may have, for example, both a function as acathode electrode and a function as a light-transmissive layer, and maybe desirably made of a material with high electrical conductivity andhigh light transmittance. Therefore, the second electrode 23 may be madeof, for example, an alloy of aluminum (Al), magnesium (Mg), silver (Ag),calcium (Ca), or sodium (Na). In particular, an alloy of magnesium andsilver (a Mg—Ag alloy) may be preferable, because the Mg—Ag alloy hasboth electrical conductivity and small absorption in a thin film.Although a ratio of magnesium to silver in the Mg—Ag alloy is notspecifically limited, the ratio may be preferably within a range ofMg:Ag=about 20:1 to about 1:1 both inclusive in film thickness ratio.Alternatively, as the material of the second electrode 23, an alloy ofaluminum (Al) and lithium (Li) (an Al—Li alloy) may be used, and indiumtin oxide (ITO), zinc oxide (ZnO), alumina-doped zinc oxide (AZO),gallium-doped zinc oxide (GZO), indium zinc oxide (IZO), indium titaniumoxide (ITiO), indium tungsten oxide (IWO), or the like may be used. Thesecond electrode 23 may be configured by laminating a plurality offilms. For example, a film made of magnesium, silver, or an alloy ofmagnesium or silver may be laminated on a film made of calcium, barium(Ba), lithium, cesium (Cs), indium (In), magnesium, silver, or the liketo configure the second electrode 23. A thickness of the secondelectrode 23 may be, for example, about 50 nm to about 500 nm bothinclusive.

A high-resistance layer (not illustrated) may be provided between theorganic layer 22 and the second electrode 23. The high-resistance layeris configured to prevent the occurrence of a short circuit between thefirst electrode 21 and the relay electrode 14, and the second electrode23, and is provided as a common layer for all of the organiclight-emitting devices 20. The high-resistance layer has higherelectrical resistance than the first electrode 21 and the secondelectrode 23, and has a charge transport function or a charge injectionfunction. In a case where a particle (a foreign matter) or a protrusionis unintentionally adhered to the first electrode 21 and the organiclayer 22 is formed in this state, a short circuit may be caused bycontact between the first electrode 21 and the second electrode 23. Suchcontact between the first electrode 21 and the second electrode 23 isallowed to be prevented by the high-resistance layer.

The high-resistance layer may be preferably made of, for example, amaterial with electrical resistivity of about 1×10⁶ Ω·m to about 1×10⁸Ω·m both inclusive, because within this range, the occurrence of a shortcircuit is allowed to be sufficiently prevented, and a drive voltage isallowed to be kept low. The high-resistance layer may be made of, forexample, niobium oxide (Nb₂O₅), titanium oxide (TiO₂), molybdenum oxide(MoO₂, MoO₃), tantalum oxide (Ta₂O₅), hafnium oxide (HfO), magnesiumoxide (MgO), IGZO (InGaZnO_(x)), a mixture of niobium oxide and titaniumoxide, a mixture of titanium oxide and zinc oxide (ZnO), a mixture ofsilicon oxide (SiO₂) and tin oxide (SnO₂), or a mixture prepared bymixing zinc oxide with one or more of magnesium oxide, silicon oxide,and aluminum oxide (Al₂O₃). The high-resistance layer may be configuredby appropriately combining some of these materials. A high-resistancelayer with a refractive index close to refractive indices of the organiclayer 22 and the second electrode 23, for example, a refractive index ofabout 1.7 or more may be preferably used, and the refractive index ofthe high-resistance layer may be more preferably about 1.9 or more.Thus, external quantum efficiency of the light-emitting layer of theorganic layer 22 is allowed to be improved. A thickness of thehigh-resistance layer may be, for example, about 100 nm to about 1000 nmboth inclusive.

A protective layer (not illustrated) is provided on the second electrode23. The protective layer is configured to prevent entry of water intothe organic layer 22 and to enhance mechanical strength of the displayunit 1. The protective layer is made of a material with high lighttransparency and low water permeability, and a thickness of theprotective layer may be, for example, about 5 μm to about 15 μm bothinclusive. For the protective layer, one of an insulating material and aconductive material may be used. For the protective layer, for example,silicon nitride (SiN_(X)), silicon oxide (SiO_(X)), aluminum oxide(AlO_(X)), or a combination thereof may be used. The sealing substrate31 is bonded to the protective layer with the sealing layer 25 inbetween. The sealing layer 25 may be made of, for example, athermosetting resin, an ultraviolet curable resin, or the like.

The sealing substrate 31 is configured to seal the respective organiclight-emitting devices 20 together with the protective layer, and may bemade of, for example, a material transparent to red light, green light,and blue light, for example, glass. A color filter 32 and alight-shielding layer 33 are provided on a surface facing the substrate11 of the sealing substrate 31, and are covered with an overcoat layer34.

The color filter 32 may include, for example, a red filter 32R, a greenfilter 32G, and a blue filter (all not illustrated) that are arrangedcorresponding to each pattern of the light-shielding layer 33 and theorganic light-emitting device 20. The color filter 32 may be provided ina position overlapping the light-shielding layer 33. Each of the redfilter 32R, the green filter 32G, and the blue filter may be made of,for example, a resin mixed with a pigment or a dye. Each of the redfilter 32R, the green filter 32G, and the blue filter is adjusted byselecting the pigment or the dye to have high light transmittance in atarget wavelength range of red, green, or blue. The light transmittanceof the color filter 32 is low in a wavelength range out of the targetwavelength range. A thickness of the color filter 32 may be, forexample, about 1 μm to about 4 μm both inclusive. The color filter 32may be provided on a surface opposite to the surface facing thesubstrate 11 of the sealing substrate 31; however, the color filter 32may be preferably provided on the surface facing the substrate 11 of thesealing substrate 31, because the color filter 32 is not exposed to asurface, and is allowed to be protected by the sealing layer 25 or thelike. Moreover, since a distance between the light-emitting layer 22 andthe color filter layer 32 is narrowed, light emitted from the organiclayer 22 is allowed to be prevented from entering an adjacent colorfilter of another color to cause color mixing.

The light-shielding layer 33 is a so-called black matrix (BM). Thelight-shielding layer 33 may be patterned in, for example, a matrix formaccording to the arrangement of the pixels PXLC in the display region 40(refer to FIG. 2 ). The light-shielding layer 33 may be made of, forexample, carbon black. A material having a light-shielding property andelectrical conductivity, chromium, graphite, and the like may be usedfor the light-shielding layer 33. Alternatively, the light-shieldinglayer 33 may be configured of a thin-film filter using an interferenceof a thin film. The thin film filter may be configured to attenuatelight, for example, by laminating one or more thin films made of ametal, a metal nitride, a metal oxide, or the like to cause aninterference of the thin films. Examples of such a thin film filter mayinclude a thin film filter including a laminate of silicon nitride (SiN)with a thickness of about 65 nm, amorphous silicon (a-Si) with athickness of about 20 nm, and molybdenum (Mo) with a thickness of about50 nm or more in this order from a position closer to the sealingsubstrate 31 or a thin film filter including a laminate of molybdenumoxide (MoO_(x)) with a thickness of about 45 nm, molybdenum with athickness of about 10 nm, molybdenum oxide with a thickness of about 40nm, and molybdenum (Mo) with a thickness of 50 nm or more in this orderfrom a position closer to the sealing substrate 31.

The overcoat layer 34 is a coating agent for enhancing flatness of asurface of the color filter 32 and protecting the surface of the colorfilter 32, and may be made of, for example, an organic material such asa resin or an inorganic material such as SiO, SiN, or ITO.

[Manufacturing Method]

For example, the above-described display unit 1 may be manufactured bythe following processes (refer to FIGS. 5A to 6B).

(Process of Forming TFT Layer and Planarization Layer)

First, after a drive circuit including the TFT layer 12 and the drivewire 13A are formed on the substrate 11 by a predetermined thin filmprocess, the planarization layer 13 is formed on an entire surface ofthe substrate 11 by, for example, a spin coating method or a slitcoating method. Next, the formed planarization layer 13 is patterned ina predetermined shape by, for example, a photolithography method to formthe connection hole H1 in the planarization layer 13 (refer to FIG. 5A).

(Process of Forming Relay Electrode)

Next, after, for example, a film of an Al—Nd alloy is formed on theplanarization layer 13 on the entire surface of the substrate 11 withuse of a sputtering method, the film is patterned with use of aphotolithography method to form the relay electrode 14 (refer to FIG.5B). At this time, the relay electrode 14 is configured to beelectrically connected to the drive wire 13A through the connection holeH1 of the planarization layer 13.

(Process of Forming Filling Member and Partition Wall)

After the relay electrode 14 is provided, as illustrated in FIG. 5C, thefilling member 15 is formed in the connection hole H1, and the partitionwall 24 is formed on the planarization layer 13. More specifically,first, for example, a film of photosensitive resin material is formed inthe connection hole H1 and on the planarization layer 13 and the relayelectrode 14 by a spin coating method. Next, after the film is exposedto light with use of a predetermined photo mask, the film is developed,and then is patterned with use of a wet etching method. Accordingly, thefilling member 15 and the partition wall 24 are formed in a sameprocess. The connection hole H1 of the planarization layer 13 is filledby forming the filling member 15 to reduce a level difference caused bythe connection hole HE The filling member 15 and the partition wall 24have a tapered shape by using the wet etching method to form the fillingmember 15 and the partition wall 24.

(Process of Forming Organic Light-emitting Device)

Next, as illustrated in FIG. 6A, the first electrode 21 is formed from atop of the filing member 15 to a top of the relay electrode 14. Thefirst electrode 21 is formed by forming a film of, for example, an AlNdalloy on the entire surface of the substrate 11 by a sputtering method,and then patterning the film with use of, for example, aphotolithography method. At this time, the first electrode 21 isconfigured to be electrically connected to the relay electrode 14 byforming the first electrode 21 in contact with the relay electrode 14.After that, the organic layer 22 including the light-emitting layer andthe second electrode 23 are formed in the entire display region 40 onthe substrate 11 by, for example, a physical vapor deposition (PVD)method such as a vacuum deposition method (refer to FIG. 6B). Theorganic layer 22 and the second electrode 23 may be formed by a printingmethod such as a screen printing method and an ink jet printing method,a laser transfer method, a coating method, or the like.

(Process of Forming Sealing Substrate)

The light-shielding layer 33, the color filter 32, and the overcoatlayer 34 are formed on the sealing substrate 31 by, for example, thefollowing process. First, after a film made of the material of thelight-shielding layer 33 is formed on the entire surface of the sealingsubstrate 31, the film is patterned in a matrix form with use of, forexample, a photolithography process to form a plurality of openingsaccording to the arrangement of the pixels PXLC. Accordingly, thelight-shielding layer 33 is formed. Next, the red filters 32R, the greenfilters 32G, and the blue filters are sequentially provided to theopenings of the light-shielding layer 33 by patterning to form the colorfilter 32. After that, the overcoat layer 34 is formed on the entiresurface of the sealing substrate 31 where the color filter 32 isprovided.

(Process of Bonding Substrate and Sealing Substrate)

The sealing substrate 31 formed as described above is bonded to thesubstrate 11 with the organic light-emitting devices 20 and the sealinglayer 25 in between by, for example, an ODF (One Drop Fill) process.Thus, the display unit 1 illustrated in FIG. 1 is completed.

[Operation of Display Unit 1]

In the display unit 1, a drive current according to an image signal ofeach color is applied to each of the organic light-emitting devices 20,electrons and holes are injected into the organic layer 22 through thefirst electrode 21 and the second electrode 23 or through the relayelectrode 14 and the second electrode 23. These electrons and theseholes are recombined in the light-emitting layer included in the organiclayer 22 to cause light emission. The light is reflected by the firstelectrode 21 and the relay electrode 14, and passes through the secondelectrode 23, the color filter 32, and the sealing substrate 31 to beextracted to outside. Thus, in the display unit 1, for example, afull-color image of R, G, and B is displayed. Moreover, a chargecorresponding to the image signal is stored in the retention capacitordevice 44C (refer to FIG. 3 ) by applying a potential corresponding tothe image signal to an end of the retention capacitor device 44C duringthe image display operation.

In this case, in the display unit 1, since the filling member 15 isprovided in the connection hole H1 of the planarization layer 13, alevel difference caused by the connection hole H1 is reduced, and thelight emission region E (refer to the part (B) in FIG. 4 ) is allowed tobe formed in a position overlapping the connection hole H1 in a planview. This will be described below.

COMPARATIVE EXAMPLES

FIG. 7 illustrates a configuration of a main part of a display unit (adisplay unit 100) according to Comparative Example 1. A part (A) in FIG.7 illustrates a sectional configuration of the display unit 100, and apart (B) in FIG. 7 illustrates a planar configuration of the displayunit 100. In the display unit 100, the relay electrode is not provided,and a first electrode (a first electrode 121) is connected to the drivewire 13A through the connection hole H1 of the planarization layer 13. Apartition wall (a partition wall 124) is provided directly above theconnection hole H1, and in a region overlapping the connection hole H1in a plan view, the first electrode 121 and the organic layer 22 areelectrically isolated from each other. In other words, a regionoverlapping the connection hole H1 in a plan view is a non-lightemission region, and the light emission region E is so arranged as toavoid the position of the connection hole H1.

FIG. 8 illustrates a configuration of a display unit (a display unit100A according to Comparative Example 2) in which the light emissionregion E is formed even in the region overlapping the connection hole H1in a plan view. A part (A) in FIG. 8 illustrates a sectionalconfiguration of the display unit 100A, and a part (B) in FIG. 8illustrates a planar configuration of the display unit 100A. When thefirst electrode 121, the organic layer 22, and the second electrode 23are formed without forming the partition wall (a partition wall 124A) onthe connection hole H1 in such a manner, as illustrated in FIG. 9 , ashort circuit (a short-circuited section S) between the first electrode121 and the second electrode 23 may be caused by a level difference bythe connection hole H1, thereby not emitting light properly. Morespecifically, it is difficult to form the organic layer 22 with auniform thickness on a wall surface of the connection hole H1 with asteep slope, thereby parting the organic layer 22. The short circuitbetween the first electrode 121 and the second electrode 23 occurs in aportion where the organic layer 22 is parted. In particular, in a casewhere the organic layer 22 is formed by an evaporation method, the firstelectrode 121 and the second electrode 23 are easily short-circuited atthe connection hole H1.

On the other hand, in the display unit 1, since the filling member 15 isprovided in the connection hole H1 of the planarization layer 13, thewall surface of the connection hole H1 is covered with the fillingmember 15 to reduce the level difference caused by the connection holeH1. Therefore, the organic layer 22 is easily formed with apredetermined thickness in a position overlapping the connection hole H1in a plan view. The first electrode 21 provided in a position coveringthe filling member 15 is configured to be electrically connected to thedrive wire 13A through the relay electrode 14, and the organic layer 22and the second electrode 23 are provided on the first electrode 21;therefore, light is emitted from above the connection hole HE In otherwords, a region overlapping the connection hole H1 in a plan view servesas the light emission region E.

Thus, the light emission region E is allowed to be arranged freelyirrespective of the position of the connection hole H1; therefore, inthe display unit 1, higher definition is achievable by reducing an areaof a pixel region. Moreover, a ratio of the light emission region E tothe pixel region is allowed to be increased. This will be describedbelow.

FIGS. 10 and 11 illustrate a planar shape of the light emission region Ein a pixel (for example, the pixel PXLC in FIG. 3 ). A part (A) in FIG.10 and a part (A) in FIG. 11 illustrate a pixel in which the lightemission region E is formed out of a region including the connectionhole H1, and a part (B) in FIG. 10 and a part (B) in FIG. 11 illustratea pixel in which the light emission region E is formed in the regionincluding the connection hole H1. An edge of the pixel is separated fromthe light emission region E by, for example, a distance Lm.

The area of the light emission region E in the part (A) in FIG. 10 andthe area of the light emission region E in the part (B) in FIG. 10 areequal to each other. At this time, in the part (B) in FIG. 10 , thenon-light emission region around the connection hole H1 is not provided;therefore, the area of the pixel region (a pixel region P2) is allowedto be smaller than the area of the pixel region (a pixel region P1) inthe part (A) in FIG. 10 . In other words, in a display unit having thepixel region P2, higher definition is achievable.

On the other hand, the areas of the pixel regions (the pixel regions P1)in the parts (A) and (B) in FIG. 11 are equal to each other. At thistime, in the part (B) in FIG. 11 , the light emission region E expandsto a portion overlapping the connection hole H1; therefore, the ratio ofthe light emission region E to the pixel region P1 is allowed to behigher than that in the part (A) in FIG. 11 . When the ratio of thelight emission region E to the pixel region P1 is increased, currentdensity of the organic light-emitting device 20 is allowed to bereduced.

FIG. 12 illustrates a relationship between magnitude of current densityand luminance degradation of the organic light-emitting device. A brokenline indicates luminance degradation of the organic light-emittingdevice with relatively large current density, and a solid line indicatesluminance degradation of the organic light-emitting device withrelatively small current density. When the current density is reduced insuch a manner, the luminance degradation of the organic light-emittingdevice is allowed to be reduced.

As described above, in this embodiment, since the filling member 15 isprovided in the connection hole H1 of the planarization layer 13, thelight emission region E is allowed to be arranged more freely.Therefore, in the display unit 1, higher definition is achievable.Moreover, the ratio of the light emission region E to the pixel regionis allowed to be increased, and the current density of the organiclight-emitting device 20 is allowed to be reduced.

Moreover, the material of the filling member 15 is the same as thematerial of the partition wall 24, and the filling member 15 and thepartition wall 24 are allowed to be formed in a same process; therefore,an increase in process number is allowed to be suppressed.

Modification examples of the above-described first embodiment and otherembodiments will be described below. In the following description, likecomponents are denoted by like numerals as of the above-described firstembodiment and will not be further described.

Modification Example 1

FIG. 13 illustrates a sectional configuration of a main part of adisplay unit (a display unit 1A) according to Modification Example 1. Inthe display unit 1A, a first electrode (a first electrode 21A) is madeof a light-transmissive material. Except for this point, the displayunit 1 has a configuration similar to that of the display unit 1, andhas functions, and effects similar to those of the display unit 1.

In the first electrode 21A, any of the conductive materials exemplifiedin the description of the material of the above-described secondelectrode 23 may be used. The relay electrode 14 is made of ahigh-reflective material as with the description of the display unit 1.More specifically, any of the conductive materials with lightreflectivity exemplified in the description of the first electrode 21 ofthe above-described display unit 1 may be used for the relay electrode14.

In such a display unit 1A, light (light L1) toward the relay electrode14 of light emitted from the organic light-emitting device 20 isreflected by the relay electrode 14 in the connection hole H1 of theplanarization layer 13. The light L1 is reflected by the relay electrode14 to be condensed, and the light L1 passes through the first electrode21A with light transparency to be extracted from the sealing substrate31 (refer to FIG. 1 ). Therefore, in the display unit 1A, frontluminance is allowed to be improved.

Modification Example 2

FIG. 14 illustrates a sectional configuration of a main part of adisplay unit (a display unit 1B) according to Modification Example 2. Asillustrated in FIG. 14 , one relay electrode 14 may be connected to thedrive wire 13A through a plurality of connection holes H1. At this time,the filing member 15 is provided to each of the connection holes H1. Ina case where the first electrode with light transparency (the firstelectrode 21A in FIG. 13 ) and the relay electrode 14 with lightreflectivity are used in combination, front luminance is allowed to beimproved by providing a plurality of connection holes H1.

Modification Example 3

FIG. 15 illustrates a sectional configuration of a main part of adisplay unit (a display unit 1C) according to Modification Example 3.The relay electrode 14 of the display unit 1C also functions as one ofelectrodes of the retention capacitor device (the retention capacitordevice 44C in FIG. 3 ). Except for this point, the display unit 1C has aconfiguration similar to that of the display unit 1, and has functionsand effects similar to those of the display unit 1.

The display unit 1C may include, for example, a capacity electrode 13Bin a same layer as that of the drive wire 13A. The capacity electrode13B is provided in a position facing a partial region of the relayelectrode 14. In the planarization layer 13, a hole H2 penetrating theplanarization layer 13 is provided in a position facing the capacityelectrode 13B. A capacity insulating film 131 is provided between thehole H2 of the planarization layer 13 and the capacity electrode 13B. Inother words, in the hole H2, the relay electrode 14 and the capacityelectrode 13B face each other with the capacity insulating film 131 inbetween to configure a retention capacitor device. The connection holeH1 penetrates the capacity insulating film 131 to electrically connectthe relay electrode 14 and the drive wire 13A to each other.

Modification Example 4

FIG. 16 illustrates a sectional configuration of a main part of adisplay unit (a display unit 1D) according to Modification Example 4. Inthe display unit 1D, an end of the first electrode 21 together with anend of the relay electrode 14 is covered with the partition wall 24.Except for this point, the display unit 1D has a configuration similarto that of the display unit 1, and has functions and effects similar tothose of the display unit 1.

The first electrode 21 may extend throughout a wider region than therelay electrode 14 in a plan view to cover the end of the relayelectrode 14. In other words, the end of the first electrode 21 isprovided outside the end of the relay electrode 14. In the display unit1D, the end of the first electrode 21 is covered with the partition wall24; therefore, the occurrence of the short circuit between the firstelectrode 21 and the second electrode 23 caused by the thickness of thefirst electrode 21 is suppressed. This will be described below.

In a case where the end of the first electrode 21 is not covered withthe partition wall 24 (for example, refer to FIG. 1 ), the end of thefirst electrode 21 is exposed, and the organic layer 22 and the secondelectrode 23 are laminated even on the end of the first electrode 21.Since there is a level difference by the thickness of the firstelectrode 21 at the end of the first electrode 21, the organic layer 22may be parted to cause a short circuit between the first electrode 21and the second electrode 23. The occurrence of the short circuit betweenthe first electrode 21 and the second electrode 23 caused by thethickness of the first electrode 21 is allowed to be prevented bycovering the end of the first electrode 21 with the partition wall 24.

Such a partition wall 24 may be formed, for example, after the fillingmember 15 and the first electrode 21 are provided. It is only necessaryto cover the end of the first electrode 21 with the partition wall 24,and the end of the first electrode 21 may be provided inside the end ofthe relay electrode 14.

Modification Example 5

FIG. 17 illustrates a sectional configuration of a display unit (adisplay unit 1E) according to Modification Example 5. The display unit1E includes a reflecting member 26 (a first reflecting member) on a sidesurface of the partition wall 24. Except for this point, the displayunit 1E has a configuration similar to that of the display unit 1, andhas functions and effects similar to those of the display unit 1.

The reflecting member 26 is configured to reflect light emitted from theorganic light-emitting device 20, and may be provided, for example, froma top surface of the partition wall 24 to the side surface of thepartition wall 24. The reflecting member 26 may be made of, for example,a material similar to that of the above-described first electrode 21,and has a thickness of about 10 nm to about 100 nm both inclusive. Sucha reflecting member 26 is allowed to be formed together with the firstelectrode 21 in a same process.

As illustrated in FIG. 18 , after light (light L2) toward the partitionwall 24 of light emitted from the organic light-emitting device 20 isreflected by the reflecting member 26, the light L2 is extracted fromthe sealing substrate 31. Since the light L2 is reflected by thereflecting member 26 in such a manner, the occurrence of color mixing issuppressed.

As illustrated in FIG. 19 , in a case where the reflecting member is notprovided, light (light L3) toward the partition wall 24 of the lightemitted from the organic light-emitting device 20 passes through thepartition wall 24; therefore, for example, light emitted from theorganic light-emitting device 20R configuring the red pixel PXLC maypass through the green filter 32G to be extracted. Such light L3 becomesleak light to the green pixel PXLC located adjacent to the red pixelPXLC to cause color mixing.

On the other hand, when the side surface of the partition wall 24 iscovered with the reflecting member 26, the light L2 is reflected by thereflecting member 26 toward a central portion of each of the pixelsPXLC. Therefore, leak light toward the adjacent pixels PXLC is allowedto be prevented, and the occurrence of color mixing is allowed to besuppressed. Moreover, front luminance is allowed to be improved in thedisplay unit 1E.

The reflecting member 26 may be provided separately for each sidesurface of the partition wall 24 (refer to FIG. 17 ), and as illustratedin FIG. 20 , the reflecting member 26 may be integrally provided fromthe top surface of the partition wall 24 to each side surface of thepartition wall 24.

Second Embodiment

FIG. 21 illustrates a sectional configuration of a main part of adisplay unit (a display unit 2) according to a second embodiment of thepresent technology. A part (A) in FIG. 21 illustrates a sectionalconfiguration and a part (B) in FIG. 21 illustrates a planarconfiguration. In the display unit 2, the first electrode (a firstelectrode 21B) extends on the partition wall 24, and the shape of thelight emission region E is controlled by the first electrode 21B. Exceptfor this point, the display unit 2 has a configuration similar to thatof the display unit 1, and has functions and effects similar to those ofthe display unit 1.

The first electrode 21B may be provided throughout a wider region thanthe relay electrode 14 in a plan view (refer to the part (B) in FIG. 21). The first electrode 21B covers the filling member 15, and extends tothe surrounding of the filling member 15 to also cover the side surfaceof the partition wall 24. Light is emitted from above the partition wall24 covered with the first electrode 21B, and a region where the firstelectrode 21B is provided serves as the light emission region E.

As illustrated in FIG. 22 , when the first electrode 21B is made of alight-reflective material, the light L2 toward the partition wall 24 ofthe light emitted from the organic light-emitting device 20 is reflectedby the first electrode 21B on the side surface of the partition wall 24,and then is extracted from the sealing substrate 31. Therefore, in asimilar manner to the description of the above-described display unit1E, the occurrence of color mixing is allowed to be suppressed, andfront luminance is allowed to be improved.

Modification Example 6

FIG. 23 illustrates a sectional configuration of a display unit (adisplay unit 2A) according to Modification Example 6. In the displayunit 2A, the filling member 15 and the partition wall 24 are in contactwith each other, and are integrally formed. Except for this point, thedisplay unit 2A has a configuration similar to that of the display unit2, and has functions and effects similar to those of the display unit 2.

For example, the filing member 15 and the partition wall 24 havingdifferent heights from each other are integrally formed by graduallychanging their heights (refer to FIG. 23 ).

As illustrated in FIG. 24 , the filing member 15 and the partition wall24 may be integrally formed by allowing the height of the filling member15 to be equal to the height of the partition wall 24.

Modification Example 7

FIG. 25 illustrates a sectional configuration of a display unit (adisplay unit 2B) according to Modification Example 7. In the displayunit 2B, the end of the first electrode 21B is covered with a partitionwall 27 (a second partition wall). Except for this point, the displayunit 2B has a configuration similar to that of the display unit 2, andhas functions and effects similar to those of the display unit 2.

For the partition wall 27, for example, an insulating material similarto that of the above-described partition wall 24 may be used. Forexample, such a partition wall 27 is provided on the partition wall 24to cover the end of the first electrode 21B. After the first electrode21B is provided on the partition wall 24, the partition wall 27 isallowed to be formed by forming a film of an insulating material on theentire surface of the substrate 11, and patterning the film with use of,for example, a photolithography method.

When such a partition wall 27 is provided, the occurrence of a shortcircuit between the first electrode 21B and the second electrode 23caused by the thickness of the first electrode 21B is allowed to beprevented in a manner similar to the description of the above-describeddisplay unit 1D.

Third Embodiment

FIG. 26 illustrates a sectional configuration of a main part of adisplay unit (a display unit 3) according to a third embodiment of thepresent technology. The display unit 3 further includes a partition wall28 (a third partition wall) between the partition walls 24 provided toboth ends of the relay electrode 14. Except for this point, the displayunit 3 has a configuration similar to that of the display unit 1, andhas functions and effects similar to those of the display unit 1.

The partition wall 28 is so provided as to cover a part of the surfaceof the relay electrode 14. One partition wall 28 may be provided to onerelay electrode 14 (not illustrated), or a plurality of partition walls28 may be provided to one relay electrode 14. The plurality of partitionwalls 28 are arranged at predetermined intervals on the relay electrode14. FIG. 26 illustrates a case where three partition walls 28 areprovided between the partition walls 24 provided to both ends of therelay electrode 14; however, the number of the partition walls 28 may beany number. Protrusions and depressions are formed on the surface of therelay electrode 14 by providing such partition walls 28. The partitionwall 28 may be made of, for example, the same material as that of theabove-described partition wall 24, and has a height equal to the heightof the partition wall 24. The partition wall 28 may be formed in thesame process as the process of forming the partition wall 24.

FIGS. 27, 28, and 29 illustrates an example of configurations of thepartition walls 24 and 28. A part (A) in FIG. 27 , a part (A) in FIG. 28, and a part (A) in FIG. 29 illustrate sectional configuration examplesof the partition walls 24 and 28, and a part (B) in FIG. 27 , a part (B)in FIG. 28 , and a part (B) in FIG. 29 illustrate planar configurationexamples of the partition walls 24 and 28. As illustrated in the part(B) in FIG. 27 , the partition wall 24 and the partition wall 28 may beintegrated. At this time, the relay electrode 14 and the first electrode21B may be in contact with each other in, for example, an island-shapedregion such as a dot shaped region. Alternatively, as illustrated in thepart (B) in FIG. 28 and the part (B) in FIG. 29 , the partition wall 24and the partition wall 28 may be separated from each other. Thepartition wall 28 may be formed, for example, in a rectangular shape(refer to the part (B) in FIG. 28 ) or in a circular shape (refer to thepart (B) in FIG. 29 ) around the connection hole H1.

The first electrode 21B covers the partition wall 28 (refer to FIG. 26), and the organic layer 22 and the second electrode 23 are laminated onthe first electrode 21B. Thus, a surface area of the organic layer 22formed along a surface with protrusions and depressions is larger than asurface of the organic layer 22 provided on a flat surface (for example,refer to the display unit 2 in FIG. 21 ). Therefore, the capacity of theauxiliary capacitor device 44D (refer to FIG. 3 ) is allowed to beincreased.

In the display unit 3, a region where the first electrode 21B isprovided serves as the light emission region E, and light is alsoemitted from above the partition wall 28.

As illustrated in FIG. 30 , when the first electrode 21B is made of alight-reflective material, light (light L4) toward the partition wall 28of light emitted from the organic light-emitting device 20 is reflectedby the first electrode 21B on a side surface of the partition wall 28,and then is extracted from the sealing substrate 31. Therefore, in amanner similar to the description of the above-described display unit1E, the occurrence of color mixing is suppressed, and front luminance isallowed to be improved.

As illustrated in FIGS. 31, 32, and 33 , the filling member 15 and thepartition wall 24 may be integrated. A part (A) in FIG. 31 , a part (A)in FIG. 32 , and a part (A) in FIG. 33 illustrate sectionalconfiguration examples of the partition walls 24 and 28, and a part (B)in FIG. 31 , a part (B) in FIG. 32 , and a part (B) in FIG. 33illustrate planar configuration examples of the partition walls 24 and28. As with the above description referring to FIGS. 27, 28, and 29 ,the partition wall 24 and the partition wall 28 may be integrated (referto FIG. 31 ), or the partition wall 24 and the partition wall 28 may beseparated from each other (refer to FIGS. 32 and 33 ).

Moreover, as illustrated in FIG. 34 , a partition wall 27 configured tocover the end of the first electrode 21B may be provided.

Modification Example 8

FIG. 35 illustrates a sectional configuration of a display unit (adisplay unit 3A) according to Modification Example 8. The display unit3A includes a reflecting member 26 (a second reflecting member) on aside surface of the partition wall 28. Except for this point, thedisplay unit 3A has a configuration similar to that of the display unit3, and has functions and effects similar to those of the display unit 3.

The first electrode 21B of the display unit 3A is provided on theconnection hole H1 and its neighborhood, and is not provided on the sidesurfaces of the partition walls 24 and 28. The side surfaces of thepartition walls 24 and 28 are covered with the reflecting member 26.

The first electrode 21B, the organic layer 22, and the second electrode23 are laminated in this order on the connection hole H1 and itsneighborhood, and the relay electrode 14, the organic layer 22, and thesecond electrode 23 are laminated in this order in a space between thepartition walls 24 and 28 (between the partition walls 28 and betweenthe partition wall 28 and the partition wall 24). Therefore, in thedisplay unit 3A, light is emitted from above the connection hole H1 andits neighborhood and from the space between the partition walls 24 and28.

As illustrated in FIG. 36 , in the display unit 3A, the light L4 towardthe partition wall 28 of the light emitted from the organiclight-emitting device 20 is reflected by the reflecting member 26 on theside surface of the partition wall 28, and then is extracted from thesealing substrate 31. Therefore, in a manner similar to the descriptionof the above-described display unit 1E, the occurrence of color mixingis suppressed, and front luminance is allowed to be improved.

Modification Example 9

FIG. 37 illustrates a sectional configuration of a display unit (adisplay unit 3B) according to Modification Example 9. In the displayunit 3B, the end of the first electrode 21 together with the end of therelay electrode 14 is covered with the partition wall 24. Except of thispoint, the display unit 3B has a configuration similar to that of thedisplay unit 3, and has functions and effects similar to those of thedisplay unit 3.

The first electrode 21 of the display unit 3B covers the partition wall28. In other words, the first electrode 21 is provided on the sidesurface of the partition wall 28. The first electrode 21 may extend, forexample, throughout a wider region than the relay electrode 14 in a planview to cover the end of the relay electrode 14. Thus, in the displayunit 3B in which the end of the first electrode 21 is covered with thepartition wall 24, in a manner similar to the description of the displayunit 1D (refer to FIG. 16 ), the occurrence of a short circuit betweenthe first electrode 21 and the second electrode 23 caused by thethickness of the first electrode 21 is suppressed.

Fourth Embodiment

FIG. 38 illustrates a sectional configuration of a main part of adisplay unit (a display unit 4) according to a fourth embodiment of thepresent technology. The display unit 4 is a bottom emission type displayunit, and light (light L5) emitted from the organic light-emittingdevice 20 is extracted from the substrate 11. Except for this point, thedisplay unit 4 has a configuration similar to that of the display unit1, and has functions and effects similar to those of the display unit 1.

In the display unit 4, for example, each of the drive wire 13A, therelay electrode 14, and the first electrode 21 may be made of aconductive material with high light transmittance, and the secondelectrode 23 may be made of a conductive material with reflectivity.Examples of the conductive material with high light transmittance mayinclude the materials of the second electrode 23 described in theabove-described display unit 1, and examples of the conductive materialwith light reflectivity may include the materials of the first electrode21 and the relay electrode 14 described in the above-described displayunit 1.

Light toward the first electrode 21 of the light emitted from theorganic light-emitting device 20 passes through the first electrode 21to be extracted from the substrate 11. Light toward the second electrode23 of the light emitted from the organic light-emitting device 20 isreflected by the second electrode 23, and passes through the organiclayer 22 and the first electrode 21 to be extracted from the substrate11.

APPLICATION EXAMPLES

Next, application examples of the above-described display units (thedisplay units 1, 1A, 1B, 1C, 1D, 1E, 2, 2A, 3, 3A, and 4) to electronicapparatuses will be described below. Examples of the electronicapparatuses may include televisions and smartphones. In addition, theabove-described display units are applicable to electronic apparatusesin any fields that display, as an image or a picture, an image signalinput from an external device or an image signal produced inside, andare applicable to, for example, tablets and vehicle-mounted displays.

(Module)

Any of the above-described display units is incorporated as, forexample, a module illustrated in FIG. 39 into various electronicapparatuses such as Application Examples 1 and 2 that will be describedlater. This module may be configured, for example, by providing a region61 exposed from the sealing substrate 31 on one side of the substrate 11and extending wiring lines of a horizontal selector 41, a write scanner42, and a power supply scanner 43 to form an external connectionterminal (not illustrated) in the exposed region 61. A flexible printedcircuit (FPC) 62 for signal input and output may be provided to theexternal connection terminal.

Application Example 1

FIG. 40 illustrates an appearance of a smartphone to which any of thedisplay units according to the above-described embodiments and the likeis applied. The smartphone may include, for example, a display section230 and a non-display section 240, and the display section 230 isconfigured of any one of the display units according to theabove-described embodiments and the like. The display units according tothe above-described embodiments and the like have small current densityand low power consumption; therefore, the display units are suitablyused for the smartphone.

Application Example 2

FIG. 41 illustrates an appearance of a television to which any of thedisplay units according to the above-described embodiments and the likeis applied. The television may include, for example, an image displayscreen section 300 including a front panel 310 and a filter glass 320,and the image display screen section 300 is configured of any one of thedisplay units according to the above-described embodiments and the like.In the display units according to the above-described embodiments andthe like, higher definition is achievable; therefore, the display unitsaccording to the above-described embodiments and the like are suitablyused for the television.

Although the present technology is described referring to theembodiments and the modification examples thereof, the presenttechnology is not limited thereto, and may be variously modified. Forexample, the material and thickness of each layer, the method andconditions of forming each layer are not limited to those described inthe above-described embodiments and the like, and each layer may be madeof any other material with any other thickness by any other method underany other conditions.

Moreover, in the above-described embodiments and the like, a case wherea light-emitting layer for white light emission including three layers,i.e., the red light-emitting layer, the green light-emitting layer, andthe blue light-emitting layer is formed as the light-emitting layer isdescribed; however, the configuration of the light-emitting layer forwhite light emission is not superficially limited thereto, and thelight-emitting layer may have a configuration in which light-emittinglayers of two colors having a complementary color relationship such asan orange light-emitting layer and a blue light-emitting layer, or ablue-green light-emitting layer and a red light-emitting layer arelaminated. Further, in the above-described embodiments and the like, acase where the organic layer is used as the functional layer isdescribed; however, an inorganic layer including the light-emittinglayer may be used.

Furthermore, in the above-described embodiments and the like, a casewhere the first electrode 21 and the second electrode 23 serve as ananode and a cathode, respectively, is described; however, the firstelectrode 21 and the second electrode 23 may serve as a cathode and ananode, respectively.

In addition, in the above-described embodiments and the like, a casewhere the display unit is configured of three kinds of sub-pixels of red(R), green (G), and blue (B) is exemplified; however, any sub-pixelconfiguration may be adopted, and the display unit may be configured of,for example, four kinds of sub-pixels of red (R), green (G), blue (B),and white (W).

Moreover, in the above-described embodiments and the like, a case wherethe color filter 32 is provided is described; however, the display unitmay be configured without providing the color filter. For example, in acase where light-emitting layers of respective colors of red, green, andblue are formed for respective sub-pixels, or a case whereblack-and-white display is performed, the color filter may not beprovided.

It is to be noted that the effects described in this description aremerely examples; therefore, effects in the present technology are notlimited thereto, and the present technology may have other effects.

It is to be noted that the present technology may have the followingconfigurations.

(1) A display unit including:

a drive wire;

a planarization layer covering the drive wire and having a connectionhole;

a relay electrode provided on the planarization layer and configured tobe electrically connected to the drive wire through the connection hole;

a filling member made of an insulating material and provided in theconnection hole;

a first partition wall made of a same material as that of the fillingmember and covering an end of the relay electrode;

a first electrode covering the filling member and configured to beelectrically connected to the relay electrode;

a second electrode facing the first electrode; and

a functional layer located between the first electrode and the secondelectrode, the functional layer including a light-emitting layer.

(2) The display unit according to (1), in which the connection hole isfilled with the filling member.

(3) The display unit according to (1) or (2), in which an end of thefirst electrode is also covered with the first partition wall.

(4) The display unit according to any one of (1) to (3), in which thefirst electrode extends throughout a wider region than the relayelectrode in a plan view.

(5) The display unit according to (1), in which a side wall of the firstpartition wall is covered with the first electrode.

(6) The display unit according to (5), further including a secondpartition wall covering an end of the first electrode.

(7) The display unit according to any one of (1) to (6), furtherincluding a first reflecting member on a side surface of the firstpartition wall.

(8) The display unit according to (1), further including a thirdpartition wall made of a same material as that of the filling member andcovering a part of the relay electrode.

(9) The display unit according to (8), in which the third partition wallis covered with the first electrode.

(10) The display unit according to (8) or (9), in which a plurality ofthe third partition walls are provided with spaces in between.

(11) The display unit according to any one of (8) to (10), furtherincluding a second reflecting member on a side surface of the thirdpartition wall.

(12) The display unit according to any one of (1) to (11), in which

the first electrode includes a light-reflective material, and

the second electrode includes a light-transmissive material.

(13) The display unit according to any one of (1) to (11), in which

the relay electrode includes a light-reflective material, and

each of the first electrode and the second electrode includes alight-transmissive material.

(14) The display unit according to any one of (1) to (11), in which

each of the drive wire, the relay electrode, and the first electrodeincludes a light-transmissive material, and

the second electrode includes a light-reflective material.

(15) The display unit according to any one of (1) to (14), in which onerelay electrode is configured to be electrically connected to the drivewire through a plurality of the connection holes.

(16) The display unit according to any one of (1) to (15), in which athickness of the first electrode is smaller than a thickness of therelay electrode.

(17) The display unit according to any one of (1) to (16), in which thefilling member and the first partition wall are in contact with eachother.

(18) The display unit according to any one of (1) to (17), in which thefunctional layer is configured of an organic layer.

(19) An electronic apparatus provided with a display unit, the displayunit including:

a drive wire;

a planarization layer covering the drive wire and having a connectionhole;

a relay electrode provided on the planarization layer and configured tobe electrically connected to the drive wire through the connection hole;

a filling member made of an insulating material and provided in theconnection hole;

a first partition wall made of a same material as that of the fillingmember and covering an end of the relay electrode;

a first electrode covering the filling member and configured to beelectrically connected to the relay electrode;

a second electrode facing the first electrode; and

a functional layer located between the first electrode and the secondelectrode, the functional layer including a light-emitting layer.

(20) A method of manufacturing a display unit including:

forming a drive wire;

forming a planarization layer covering the drive wire, and then forminga connection hole in the planarization layer;

forming a relay electrode on the planarization layer and configuring therelay electrode to be electrically connected to the drive wire throughthe connection hole;

forming a filling member made of an insulating material in theconnection hole and forming a first partition wall covering an end ofthe relay electrode with use of a same material as that of the fillingmember;

forming a first electrode to cover the filling member and configuringthe first electrode to be electrically connected to the relay electrode;and

forming a functional layer including a light-emitting layer and a secondelectrode in this order on the first electrode.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations, and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A display unit comprising: a drive wire; a firstinsulating layer covering the drive wire and in direct contact with atleast a portion of the drive wire, the first insulating layer includinga first connection hole; a first metal wire arranged on the firstinsulating layer and configured to be electrically connected to thedrive wire through the connection hole; a filling member made of aninsulating material, arranged above the first metal wire and in thefirst connection hole; a first electrode configured to be in directcontact with and electrically connected to the first metal wire at twolocations on opposing sides of the first connection hole in across-section perspective; a second insulating layer directly atop andin direct contact with an end of the first metal wire, the secondinsulating layer being arranged so as to not be in direct contact withthe first electrode and the filling member in the cross-sectionperspective; a second electrode facing the first electrode; and afunctional layer located between the first electrode and the secondelectrode, the functional layer including a light-emitting layer and ahole injection layer, wherein the hole injection layer is above thesecond insulating layer.
 2. The display unit according to claim 1,wherein the first metal wire and a second metal wire face each otherwith a third insulating layer in between, thereby forming a capacitor.3. The display unit according to claim 2, wherein the first insulatinglayer includes a second connection hole, and the first metal wire andthe filling member cover the second connection hole.
 4. The display unitaccording to claim 2, further comprising a fourth insulating layercovering the second electrode.
 5. The display unit according to claim 1,wherein the light-emitting layer emits a white light.
 6. The displayunit according to claim 1, wherein a voltage of the first metal wire isthe same as a voltage of the first electrode.
 7. The display unitaccording to claim 1, further comprising a substrate under the drivewire.
 8. The display unit according to claim 7, wherein the substrate isformed of at least one of a glass material, a plastic material, asilicon, a resin, or a metal film.
 9. The display unit according toclaim 7, wherein the substrate is formed of a flexible material.
 10. Anelectronic apparatus comprising: a display unit, the display unitincluding: a drive wire; a first insulating layer covering the drivewire and in direct contact with at least a portion of the drive wire,the first insulating layer including a first connection hole; a firstmetal wire arranged on the first insulating layer and configured to beelectrically connected to the drive wire through the connection hole; afilling member made of an insulating material, arranged above the firstmetal wire and in the first connection hole; a first electrodeconfigured to be in direct contact with and electrically connected tothe first metal wire at two locations on opposing sides of the firstconnection hole in a cross-section perspective; a second insulatinglayer directly atop and in direct contact with an end of the first metalwire, the second insulating layer being arranged so as to not be indirect contact with the first electrode and the filling member in thecross-section perspective; a second electrode facing the firstelectrode; and a functional layer located between the first electrodeand the second electrode, the functional layer including alight-emitting layer and a hole injection layer, wherein the holeinjection layer is above the second insulating layer.
 11. The electronicapparatus according to claim 10, wherein the first metal wire and asecond metal wire face each other with a third insulating layer inbetween, thereby forming a capacitor.
 12. The electronic apparatusaccording to claim 11, wherein the first insulating layer includes asecond connection hole, and the first metal wire and the filling membercover the second connection hole.
 13. The electronic apparatus accordingto claim 11, wherein the display unit further comprises a fourthinsulating layer covering the second electrode.
 14. The electronicapparatus according to claim 10, wherein the light-emitting layer emitsa white light.
 15. The electronic apparatus according to claim 10,wherein a voltage of the first metal wire is the same as a voltage ofthe first electrode.
 16. The electronic apparatus according to claim 10,wherein the display unit further comprises a substrate under the drivewire.
 17. The electronic apparatus according to claim 16, wherein thesubstrate is formed of at least one of a glass material, a plasticmaterial, a silicon, a resin, or a metal film.
 18. The electronicapparatus according to claim 16, wherein the substrate is formed of aflexible material.